AltaSim

AltaSim logo

AltaSim has extensive experience in solving a multitude of complex engineering problems across a broad range of technologies, including:

  • Fully coupled Multiphysics analysis
  • Heat transfer
    • Transient, Stationary and Moving heat source
  • Structural mechanics
    • Static, Dynamic, Fatigue, Creep and Thermal loading
  • Computational fluid dynamics
    • Laminar, Turbulent. Multi-phase
  • Electromagnetics
    • AC/DC, RF, Microwave, Photonics, Antennae, Sensors
  • Acoustics
    • Ultrasound, Audible, Infrasound, Wave Propagation and Acoustic detection
  • Fluid-Structure
    • Flow in flexible structures, Valve closure, Flow induced vibration/noise, Vibration induced heating
  • Electronics cooling
    • System, board and component level, Thermal management
  • Materials
    • Material Processing, Material Joining, Additive Manufacturing, Piezoelectrics, Thermoelectrics
  • Plasma
    • DC, Inductively coupled, Capacitively coupled, Microwave excitation

Put our simulation expertise into a user-friendly application for routine use by your engineers so that you can realize the benefits of modeling and simulation without having to be an expert.

Please describe your problem and we'll contact you to discuss how we can help.

AltaSim Products

Featured App

HeatSinkSim

HeatSinkSim logo

HeatSinkSim solves the heat transfer problem for a vertically oriented, plate fin heat sink operating under natural convection.

Featured App

AM Therm SIM

Logo: AM Therm SIM

This application simulates the transient thermal history of the Powder Bed Fusion Additive Manufacturing process for a range of geometries, materials and laser beam parameters.

MieSIM

MieSIM App logo

MieSIM solves Maxwell’s equations for scattering of electromagnetic radiation by spherical dielectric particles and provides the basis for measuring the size of particles in the atmosphere, oil droplet in water, and cell nuclei in biological systems.

SPRSIM

SPRSIM logo

SPRSIM simulates the behavior of surface plasmons propagating at the interface between two materials for the two commonly used configurations for plasmon excitation: the Kretschmann-Raether and Otto configurations.

QUENCHSIM

QUENCHSIM logo

QUENCHSIM solves the time dependent heat transfer analysis of a component taken from a furnace and quenched with air fans. You can import a CAD file of the component into the analysis; heat transfer occurs through convection, conduction and radiation.

PeltierSIM

PeltierSIM App logo

PeltierSIM simulates the thermo-electric behavior for the conversion of heat into electricity or electricity into heat and is described by three related mechanisms: the Seebeck, Peltier and Thomson effects.

μWaveSIM

μWaveSIM App logo

μWaveSIM solves the heat transfer problem associated with an electromagnetic field inside a cavity containing a single waveguide.

BolometerSIM

BolometerSIM logo

BolometerSIM solves the thermo-electric problem of an infra-red bolometer device. Incident radiation causes a temperature rise in a thermally insulated conducting absorber mounted on an insulating dielectric heat sink.

EMMirrorSIM

EMMirrorSIM App logo

EMMirrorSIM calculates the reflectance of a dielectric mirror consisting of a number of identical dielectric bi-layers with high and low refractive indices.

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